iQOO has confirmed that it’s incoming iQOO phones: the 7 and 7 Legend will feature advanced Liquid Cooling Technology for heat dissipation. iQOO’s cooling method uses copper tubes to transfer liquid from the SoC area, outwards towards the cooler areas of the graphite plate.
This plate on the iQOO 7 has 6,000 sq mm of surface area for heat to dissipate away towards the phone’s exterior. This plate is used in conjunction with a magnesium alloy core, conductivity gel, and the vapor chamber to achieve up to 14C lower operating temperatures and up to 4C lower external surface temperature.
Meanwhile, the iQOO 7 Legend uses a Vapor Chamber with a surface area of 4,096sq. mm combined with the internal “capillary structure + power pump” which will quickly transport and disperse heat.
The iQOO 7 and 7 Legend are both going to be announced on April 26 for Amazon India. The 7 gets a Snapdragon 870 chipset, while the 7 Legend is confirmed to arrive with the Snapdragon 888.